Date of Award
12-1-2018
Degree Name
Master of Science
Department
Mechanical Engineering
First Advisor
Chu, Tsuchin
Abstract
This research project on the campus of Southern Illinois University Carbondale is an extension to the inquiry into the feasibility and reliability of the technology known as Digital Laser Speckle Image Correlation (DiLSIC). This is a hybrid approach of combining two existing technologies. The first being Digital Image Correlation (DIC) which is a nondestructive evaluation commonly used to find displacement, in-plane strain, as well as deformation. The second being the of laser speckle patterns. This hybrid has achieved level of resolution measured to be 3.4μ. DiLSIC increases the application ability of the DIC technique to situations that generally would not be an option to use. DiLSIC needs no artifact speckle patterns to be applied to the specimen as a preparation for nondestructive testing. In DIC testing, the surface of a specimen must artifact speckles applied to the subject surface. Often the application of artifact speckles is not desirable or possible. DiLSIC is an acceptable alternative to the previously discussed industry-wide practice. This method broadens the usage of the DIC technique to situations which previously were not possible. This technology can identify, quantify, and detect the distribution of strain and stress concentrations in composite structures. For this study, a honeycomb-backed glass fiber reinforced polymer (GFRP) panel from a Cessna aircraft exterior luggage door was obtained and a defect panel is created. The panel is constructed with one area containing a repair compliant with manufacturer standardized methods and a repair area is not compliant and consists of multiple incorrect repair steps. An area with no repair is also tested to act as a control for comparison and quantification. The results for the inspected areas showed a linear strain increase in the noncompliant repair. The data plot for the compliant repair showed a trend of following the same basic curve as the no repair area. A verification process follows the DiLSIC testing consisting of using Infrared Thermography, Air-coupled ultrasonic, and white light artifact speckle DIC. These tests show DiLSIC is a viable alternative to the testing that is available in the industry. DiLSIC can detect defect location, size, geometry and map strain to determine the difference between compliant and noncompliant repairs when compared to a base level non-repair area
Access
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