Date of Award

8-1-2018

Degree Name

Master of Science

Department

Mechanical Engineering

First Advisor

Chu, Tsuchin

Abstract

The primary objective of this research is to conduct further evaluation of ultrasonic digital image correlation (UT-DIC) on strain map analysis and defect detection of adhesive joints with embedded speckle pattern. UT-DIC is a non-destructive evaluation method that utilized ultrasonic C-scan images for whole field strain and displacement analysis. Acrylic glass, epoxy resin system and metal shavings with high acoustic impedance of a specific weight were used to create the samples which were loaded under tension. Defects with varying shapes and sizes were implemented by surface preparation to understand the limits of this approach. UT-DIC and optical DIC strain map results were compared, and it was found that each approach detected certain shapes of defect better than the other.

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